Artículo
Impact of sub- and supra- threshold switching in the synaptic behavior of TiO2 memristors
Fecha de publicación:
06/2018
Editorial:
Elsevier Science
Revista:
Microelectronic Engineering
ISSN:
0167-9317
Idioma:
Inglés
Tipo de recurso:
Artículo publicado
Clasificación temática:
Resumen
Al/TiO2/Au memory junctions grown by reactive sputtering were fabricated and characterized. Usual hysteretic features were obtained, spanning an order of magnitude ratio between high and low resistance states. We explored sub-threshold and supra-threshold stimuli, to describe “binary” and “analogic” synapses (i.e. synaptic emulators) characteristics in detail. We show that each type of behavior can be chosen regarding the dependence of the switching on the amplitude of voltage stimuli. The sub-threshold switching originating the analog mode is explained by the drift-diffusion of oxygen vacancies while the binary mode is attributed to the Joule-heating-assisted electric-field-induced movement of oxygen vacancies. In the supra-threshold limit we found that “excitatory” and “inhibitory” synaptic behavior can be tailored by controlling the pulsing current amplitude. We discuss this result within the artificial neural network topology framework, as changing the behavior type of the synapses results in its reconfiguration.
Palabras clave:
MEMORY
,
MEMRISTOR
,
OXIDE
,
RESISTIVE SWITCHING
Archivos asociados
Licencia
Identificadores
Colecciones
Articulos(OCA CIUDAD UNIVERSITARIA)
Articulos de OFICINA DE COORDINACION ADMINISTRATIVA CIUDAD UNIVERSITARIA
Articulos de OFICINA DE COORDINACION ADMINISTRATIVA CIUDAD UNIVERSITARIA
Articulos(SEDE CENTRAL)
Articulos de SEDE CENTRAL
Articulos de SEDE CENTRAL
Articulos(UE-INN)
Articulos de UNIDAD EJECUTORA INSTITUTO DE NANOCIENCIA Y NANOTECNOLOGIA
Articulos de UNIDAD EJECUTORA INSTITUTO DE NANOCIENCIA Y NANOTECNOLOGIA
Citación
Ghenzi, Néstor; Levy, Pablo Eduardo; Impact of sub- and supra- threshold switching in the synaptic behavior of TiO2 memristors; Elsevier Science; Microelectronic Engineering; 193; 6-2018; 13-17
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