Artículo

Formation of Cu and Ni Nanowires by Electrodeposition

Meier, Lorena Alejandra Icon; Alvarez, Andrea Elizabeth Icon; Garcia, S.G. ; del Barrio, Maria Cecilia Icon

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Fecha

01/2015

Editorial

ELSEVIER SCIENCE INC

Revista

Procedia Materials Science

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ISSN

2211-8128

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Inglés

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Resumen

In this work, the formation of Cu and Ni nanowires by electrodeposition inside alumina templates was analyzed. The depositswere performed from CuSO4 + H2SO4 and NiSO4 + NiCl2 + H3BO3 + H2SO4 solutions for the electrodeposition of Cu and Ni,respectively. To allow the cations deposition, sufficiently negative potentials were used. The experience time was rangedbetween 500s and 1h. After the metal electrodeposition, the sample was immersed in NaOH to dissolve the alumina membraneand to expose the generated deposit. The obtained nanostructures were characterized by SEM (scanning electron microscopy).Deposits were corresponded with nanowires having an average diameter of 300 nm. The length of the nanostructures was about10 microns.

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