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dc.contributor.author
Lally, Richard W.
dc.contributor.author
Imboden, Matthias
dc.contributor.author
Stange, Alexander
dc.contributor.author
Barrett, Lawrence K.
dc.contributor.author
Perez, Diego Javier
dc.contributor.author
Bishop, David J.
dc.date.available
2023-11-28T19:32:45Z
dc.date.issued
2023-03
dc.identifier.citation
Lally, Richard W.; Imboden, Matthias; Stange, Alexander; Barrett, Lawrence K.; Perez, Diego Javier; et al.; A Fully Integrated, MEMS Based, Micro-Scale Printer for Cryogenic Thin Film Structures; Institute of Electrical and Electronics Engineers; Journal Of Microelectromechanical Systems; 32; 1; 3-2023; 126-135
dc.identifier.issn
1057-7157
dc.identifier.uri
http://hdl.handle.net/11336/218758
dc.description.abstract
Cryogenically produced thin film structures at the research scale facilitate many novels experiments. This paper discusses the construction of a fully integrated, MEMS based, printer, capable of printing micro and nano-scale features. In this millimeter-sized device, many features of a nanofab are incorporated to fabricate and characterize thin films in situ. The micro-scale printer comprises surface micromachined MEMS, digitally programmable source of atoms; a stencil lithograpghy tool that uses a MEMS nanopositioner for alignment; a substrate with on-chip leads for electrical characterization; a film thickness monitor; a substrate thermometer and heater. The device consists of three separate silicon die, flip-chip bonded to each other, forming a fully integrated, fabrication system of systems. This device creates micro and nano structures ranging from a few monolayers thick up to micron scale circuits. Applications range from searching for the Casimir Energy to the direct fabrication of quantum circuits, in situ, at cryogenic temperatures. [2022-0132]
dc.format
application/pdf
dc.language.iso
eng
dc.publisher
Institute of Electrical and Electronics Engineers
dc.rights
info:eu-repo/semantics/openAccess
dc.rights.uri
https://creativecommons.org/licenses/by/2.5/ar/
dc.subject
FLIP-CHIP
dc.subject
MEMS
dc.subject
NANOFABRICATION
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QUENCHED CONDENSED THIN FILMS
dc.subject
TOP-DOWN APPROACH
dc.subject.classification
Física de los Materiales Condensados
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Ciencias Físicas
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CIENCIAS NATURALES Y EXACTAS
dc.title
A Fully Integrated, MEMS Based, Micro-Scale Printer for Cryogenic Thin Film Structures
dc.type
info:eu-repo/semantics/article
dc.type
info:ar-repo/semantics/artículo
dc.type
info:eu-repo/semantics/publishedVersion
dc.date.updated
2023-11-28T14:56:30Z
dc.journal.volume
32
dc.journal.number
1
dc.journal.pagination
126-135
dc.journal.pais
Estados Unidos
dc.journal.ciudad
Nueva York
dc.description.fil
Fil: Lally, Richard W.. Boston University; Estados Unidos
dc.description.fil
Fil: Imboden, Matthias. 4k-Mems Sàrl; Suiza
dc.description.fil
Fil: Stange, Alexander. Cellino Biotech; Estados Unidos
dc.description.fil
Fil: Barrett, Lawrence K.. Boston University; Estados Unidos
dc.description.fil
Fil: Perez, Diego Javier. Consejo Nacional de Investigaciones Cientificas y Tecnicas. Oficina de Coordinacion Administrativa Ciudad Universitaria. Unidad Ejecutora Instituto de Nanociencia y Nanotecnologia. Unidad Ejecutora Instituto de Nanociencia y Nanotecnologia - Nodo Bariloche | Comision Nacional de Energia Atomica. Unidad Ejecutora Instituto de Nanociencia y Nanotecnologia. Unidad Ejecutora Instituto de Nanociencia y Nanotecnologia - Nodo Bariloche.; Argentina
dc.description.fil
Fil: Bishop, David J.. Boston University; Estados Unidos
dc.journal.title
Journal Of Microelectromechanical Systems
dc.relation.alternativeid
info:eu-repo/semantics/altIdentifier/url/https://ieeexplore.ieee.org/document/9972841
dc.relation.alternativeid
info:eu-repo/semantics/altIdentifier/doi/http://dx.doi.org/10.1109/JMEMS.2022.3224476
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