Artículo
A Fully Integrated, MEMS Based, Micro-Scale Printer for Cryogenic Thin Film Structures
Lally, Richard W.; Imboden, Matthias; Stange, Alexander; Barrett, Lawrence K.; Perez, Diego Javier
; Bishop, David J.
Fecha de publicación:
03/2023
Editorial:
Institute of Electrical and Electronics Engineers
Revista:
Journal Of Microelectromechanical Systems
ISSN:
1057-7157
Idioma:
Inglés
Tipo de recurso:
Artículo publicado
Clasificación temática:
Resumen
Cryogenically produced thin film structures at the research scale facilitate many novels experiments. This paper discusses the construction of a fully integrated, MEMS based, printer, capable of printing micro and nano-scale features. In this millimeter-sized device, many features of a nanofab are incorporated to fabricate and characterize thin films in situ. The micro-scale printer comprises surface micromachined MEMS, digitally programmable source of atoms; a stencil lithograpghy tool that uses a MEMS nanopositioner for alignment; a substrate with on-chip leads for electrical characterization; a film thickness monitor; a substrate thermometer and heater. The device consists of three separate silicon die, flip-chip bonded to each other, forming a fully integrated, fabrication system of systems. This device creates micro and nano structures ranging from a few monolayers thick up to micron scale circuits. Applications range from searching for the Casimir Energy to the direct fabrication of quantum circuits, in situ, at cryogenic temperatures. [2022-0132]
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Colecciones
Articulos (UE-INN - NODO BARILOCHE)
Articulos de UNIDAD EJECUTORA INSTITUTO DE NANOCIENCIA Y NANOTECNOLOGIA - NODO BARILOCHE
Articulos de UNIDAD EJECUTORA INSTITUTO DE NANOCIENCIA Y NANOTECNOLOGIA - NODO BARILOCHE
Citación
Lally, Richard W.; Imboden, Matthias; Stange, Alexander; Barrett, Lawrence K.; Perez, Diego Javier; et al.; A Fully Integrated, MEMS Based, Micro-Scale Printer for Cryogenic Thin Film Structures; Institute of Electrical and Electronics Engineers; Journal Of Microelectromechanical Systems; 32; 1; 3-2023; 126-135
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