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Gomez, Roderick A.  
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Christian, Shamar F.  
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Oggier, German Gustavo  
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Fantino, Roberto Armin  
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Balda, Juan C.  
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Zhao, Yue  
dc.date.available
2023-09-11T10:05:57Z  
dc.date.issued
2022  
dc.identifier.citation
Etching Process to Reduce Interlamination Short Circuits and Core Loss Comparison for Tape-Wound Cut Cores; 13th International Symposium on Power Electronics for Distributed Generation Systems; Kiel; Alemania; 2022; 1-6  
dc.identifier.isbn
978-1-6654-6619-6  
dc.identifier.uri
http://hdl.handle.net/11336/211022  
dc.description.abstract
Soft-magnetic ribbon-based materials have been gaining popularity as their properties yield better efficiencies and power densities. Nevertheless, magnetic designs with these materials present a major shortcoming in the manufacturing process of tape-wound cut cores. Thus, this paper focuses on the critical issue of ribbon-based soft-magnetic cut-cores due to short-circuited layers along the cross-sectional area resulting from the cutting process. An etching process is proposed to overcome the interlamination short circuits of the magnetic cores. A microscopic view of the cross-sectional area demonstrates the effectiveness of the etching process. Furthermore, two identical experimental medium-frequency transformers are built to study and compare the effects of the core etching on the transformer parameters. Open- and short-circuit impedance responses, and core loss characterization over frequency and flux density are presented before and after the etching process to establish the proper process to handle these tape-wound cut cores.  
dc.format
application/pdf  
dc.language.iso
eng  
dc.publisher
Institute of Electrical and Electronics Engineers  
dc.rights
info:eu-repo/semantics/restrictedAccess  
dc.rights.uri
https://creativecommons.org/licenses/by-nc-sa/2.5/ar/  
dc.subject
NANOCRYSTALLINE CORE  
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RIBBON-BASED MAGNETIC CORE  
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MEDIUM-FREQUENCY TRANSFORMER (MFT)  
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INTERLAMINATION SHORT-CIRCUIT  
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TAPE WOUND CORES  
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CORE ETCHING  
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SOLID-STATE TRANSFORMER (SST)  
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Ingeniería Eléctrica y Electrónica  
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Ingeniería Eléctrica, Ingeniería Electrónica e Ingeniería de la Información  
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INGENIERÍAS Y TECNOLOGÍAS  
dc.title
Etching Process to Reduce Interlamination Short Circuits and Core Loss Comparison for Tape-Wound Cut Cores  
dc.type
info:eu-repo/semantics/publishedVersion  
dc.type
info:eu-repo/semantics/conferenceObject  
dc.type
info:ar-repo/semantics/documento de conferencia  
dc.date.updated
2023-08-28T11:24:46Z  
dc.journal.pagination
1-6  
dc.journal.pais
Estados Unidos  
dc.journal.ciudad
New York  
dc.description.fil
Fil: Gomez, Roderick A.. University of Arkansas for Medical Sciences; Estados Unidos  
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Fil: Christian, Shamar F.. University of Arkansas for Medical Sciences; Estados Unidos  
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Fil: Oggier, German Gustavo. Universidad Nacional de Río Cuarto; Argentina. Universidad Nacional de Río Cuarto. Facultad de Ciencias Exactas Fisicoquímicas y Naturales. Instituto de Investigaciones en Tecnologías Energéticas y Materiales Avanzados. - Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - Córdoba. Instituto de Investigaciones en Tecnologías Energéticas y Materiales Avanzados; Argentina  
dc.description.fil
Fil: Fantino, Roberto Armin. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - Bahía Blanca. Instituto de Investigaciones en Ingeniería Eléctrica "Alfredo Desages". Universidad Nacional del Sur. Departamento de Ingeniería Eléctrica y de Computadoras. Instituto de Investigaciones en Ingeniería Eléctrica "Alfredo Desages"; Argentina  
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Fil: Balda, Juan C.. University of Arkansas for Medical Sciences; Estados Unidos  
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Fil: Zhao, Yue. University of Arkansas for Medical Sciences; Estados Unidos  
dc.relation.alternativeid
info:eu-repo/semantics/altIdentifier/url/https://ieeexplore.ieee.org/document/9923076  
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dc.coverage
Internacional  
dc.type.subtype
Simposio  
dc.description.nombreEvento
13th International Symposium on Power Electronics for Distributed Generation Systems  
dc.date.evento
2022-06-26  
dc.description.ciudadEvento
Kiel  
dc.description.paisEvento
Alemania  
dc.type.publicacion
Book  
dc.description.institucionOrganizadora
Institute of Electrical and Electronics Engineers  
dc.source.libro
13th International Symposium on Power Electronics for Distributed Generation Systems  
dc.date.eventoHasta
2022-06-29  
dc.type
Simposio