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Evento

Etching Process to Reduce Interlamination Short Circuits and Core Loss Comparison for Tape-Wound Cut Cores

Gomez, Roderick A.; Christian, Shamar F.; Oggier, German GustavoIcon ; Fantino, Roberto ArminIcon ; Balda, Juan C.; Zhao, Yue
Tipo del evento: Simposio
Nombre del evento: 13th International Symposium on Power Electronics for Distributed Generation Systems
Fecha del evento: 26/06/2022
Institución Organizadora: Institute of Electrical and Electronics Engineers;
Título del Libro: 13th International Symposium on Power Electronics for Distributed Generation Systems
Editorial: Institute of Electrical and Electronics Engineers
ISBN: 978-1-6654-6619-6
Idioma: Inglés
Clasificación temática:
Ingeniería Eléctrica y Electrónica

Resumen

Soft-magnetic ribbon-based materials have been gaining popularity as their properties yield better efficiencies and power densities. Nevertheless, magnetic designs with these materials present a major shortcoming in the manufacturing process of tape-wound cut cores. Thus, this paper focuses on the critical issue of ribbon-based soft-magnetic cut-cores due to short-circuited layers along the cross-sectional area resulting from the cutting process. An etching process is proposed to overcome the interlamination short circuits of the magnetic cores. A microscopic view of the cross-sectional area demonstrates the effectiveness of the etching process. Furthermore, two identical experimental medium-frequency transformers are built to study and compare the effects of the core etching on the transformer parameters. Open- and short-circuit impedance responses, and core loss characterization over frequency and flux density are presented before and after the etching process to establish the proper process to handle these tape-wound cut cores.
Palabras clave: NANOCRYSTALLINE CORE , RIBBON-BASED MAGNETIC CORE , MEDIUM-FREQUENCY TRANSFORMER (MFT) , INTERLAMINATION SHORT-CIRCUIT , TAPE WOUND CORES , CORE ETCHING , SOLID-STATE TRANSFORMER (SST)
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info:eu-repo/semantics/restrictedAccess Excepto donde se diga explícitamente, este item se publica bajo la siguiente descripción: Creative Commons Attribution-NonCommercial-ShareAlike 2.5 Unported (CC BY-NC-SA 2.5)
Identificadores
URI: http://hdl.handle.net/11336/211022
URL: https://ieeexplore.ieee.org/document/9923076
Colecciones
Eventos(IIIE)
Eventos de INST.DE INVEST.EN ING.ELECTRICA "A.DESAGES"
Citación
Etching Process to Reduce Interlamination Short Circuits and Core Loss Comparison for Tape-Wound Cut Cores; 13th International Symposium on Power Electronics for Distributed Generation Systems; Kiel; Alemania; 2022; 1-6
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