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dc.contributor.author
Lanza, Rodolfo Mario
dc.contributor.author
Waser, Rainer
dc.contributor.author
Ielmini, Daniele
dc.contributor.author
Yang, J. Joshua
dc.contributor.author
Goux, Ludovic
dc.contributor.author
Suñe, Jordi
dc.contributor.author
Kenyon, Anthony Joseph
dc.contributor.author
Mehonic, Adnan
dc.contributor.author
Spiga, Sabina
dc.contributor.author
Rana, Vikas
dc.contributor.author
Wiefels, Stefan
dc.contributor.author
Menzel, Stephan
dc.contributor.author
Valov, Ilia
dc.contributor.author
Villena, Marco A.
dc.contributor.author
Miranda, Enrique
dc.contributor.author
Jing, Xu
dc.contributor.author
Campabadal, Francesca
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Gonzalez, Mireia B.
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Aguirre, Fernando Leonel
dc.contributor.author
Palumbo, Felix Roberto Mario
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Zhu, Kaichen
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Roldan, Juan Bautista
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Puglisi, Francesco Maria
dc.contributor.author
Larcher, Luca
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Hou, Tuo-Hung
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Prodromakis, Themis
dc.contributor.author
Yang, Yuchao
dc.contributor.author
Huang, Peng
dc.contributor.author
Wan, Tianqing
dc.contributor.author
Chai, Yang
dc.date.available
2022-08-25T12:41:47Z
dc.date.issued
2021-11
dc.identifier.citation
Lanza, Rodolfo Mario; Waser, Rainer; Ielmini, Daniele; Yang, J. Joshua; Goux, Ludovic; et al.; Standards for the Characterization of Endurance in Resistive Switching Devices; American Chemical Society; ACS Nano; 15; 11; 11-2021; 17214–17231
dc.identifier.issn
1936-0851
dc.identifier.uri
http://hdl.handle.net/11336/166558
dc.description.abstract
Resistive switching (RS) devices are emerging electronic components that could have applications in multiple types of integrated circuits, including electronic memories, true random number generators, radiofrequency switches, neuromorphic vision sensors, and artificial neural networks. The main factor hindering the massive employment of RS devices in commercial circuits is related to variability and reliability issues, which are usually evaluated through switching endurance tests. However, we note that most studies that claimed high endurances >106 cycles were based on resistance versus cycle plots that contain very few data points (in many cases even <20), and which are collected in only one device. We recommend not to use such a characterization method because it is highly inaccurate and unreliable (i.e., it cannot reliably demonstrate that the device effectively switches in every cycle and it ignores cycle-to-cycle and device-to-device variability). This has created a blurry vision of the real performance of RS devices and in many cases has exaggerated their potential. This article proposes and describes a method for the correct characterization of switching endurance in RS devices; this method aims to construct endurance plots showing one data point per cycle and resistive state and combine data from multiple devices. Adopting this recommended method should result in more reliable literature in the field of RS technologies, which should accelerate their integration in commercial products.
dc.format
application/pdf
dc.language.iso
eng
dc.publisher
American Chemical Society
dc.rights
info:eu-repo/semantics/openAccess
dc.rights.uri
https://creativecommons.org/licenses/by-nc-nd/2.5/ar/
dc.subject
CHARACTERIZATION
dc.subject
ENDURANCE
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MEMORY
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MEMRISTOR
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METAL-OXIDE
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RELIABILITY
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RESISTIVE SWITCHING
dc.subject
VARIABILITY
dc.subject.classification
Nano-materiales
dc.subject.classification
Nanotecnología
dc.subject.classification
INGENIERÍAS Y TECNOLOGÍAS
dc.title
Standards for the Characterization of Endurance in Resistive Switching Devices
dc.type
info:eu-repo/semantics/article
dc.type
info:ar-repo/semantics/artículo
dc.type
info:eu-repo/semantics/publishedVersion
dc.date.updated
2022-08-23T11:17:17Z
dc.journal.volume
15
dc.journal.number
11
dc.journal.pagination
17214–17231
dc.journal.pais
Estados Unidos
dc.journal.ciudad
Washington
dc.description.fil
Fil: Lanza, Rodolfo Mario. King Abdullah University of Science and Technology; Arabia Saudita
dc.description.fil
Fil: Waser, Rainer. Helmholtz Gemeinschaft. Forschungszentrum Jülich; Alemania. Rwth Aachen University; Alemania
dc.description.fil
Fil: Ielmini, Daniele. Politecnico di Milano; Italia
dc.description.fil
Fil: Yang, J. Joshua. University of Southern California; Estados Unidos
dc.description.fil
Fil: Goux, Ludovic. Interuniversity Microelectronics Centre; Bélgica
dc.description.fil
Fil: Suñe, Jordi. Universitat Autònoma de Barcelona; España
dc.description.fil
Fil: Kenyon, Anthony Joseph. Colegio Universitario de Londres; Reino Unido
dc.description.fil
Fil: Mehonic, Adnan. Colegio Universitario de Londres; Reino Unido
dc.description.fil
Fil: Spiga, Sabina. Consiglio Nazionale delle Ricerche; Italia. Istituto per la Microelettronica e Microsistemi; Italia
dc.description.fil
Fil: Rana, Vikas. Helmholtz Gemeinschaft. Forschungszentrum Jülich; Alemania
dc.description.fil
Fil: Wiefels, Stefan. Helmholtz Gemeinschaft. Forschungszentrum Jülich; Alemania
dc.description.fil
Fil: Menzel, Stephan. Helmholtz Gemeinschaft. Forschungszentrum Jülich; Alemania
dc.description.fil
Fil: Valov, Ilia. Helmholtz Gemeinschaft. Forschungszentrum Jülich; Alemania
dc.description.fil
Fil: Villena, Marco A.. Applied Materials Incorporated; Italia
dc.description.fil
Fil: Miranda, Enrique. Universitat Autònoma de Barcelona; España
dc.description.fil
Fil: Jing, Xu. Southeast University; China
dc.description.fil
Fil: Campabadal, Francesca. Consejo Superior de Investigaciones Científicas; España
dc.description.fil
Fil: Gonzalez, Mireia B.. Consejo Superior de Investigaciones Científicas; España
dc.description.fil
Fil: Aguirre, Fernando Leonel. Consejo Nacional de Investigaciones Científicas y Técnicas; Argentina. Universidad Tecnológica Nacional. Facultad Regional Buenos Aires. Unidad de Investigación y Desarrollo de las Ingenierías; Argentina
dc.description.fil
Fil: Palumbo, Felix Roberto Mario. Consejo Nacional de Investigaciones Científicas y Técnicas; Argentina. Universidad Tecnológica Nacional. Facultad Regional Buenos Aires. Unidad de Investigación y Desarrollo de las Ingenierías; Argentina
dc.description.fil
Fil: Zhu, Kaichen. King Abdullah University of Science and Technology; Arabia Saudita
dc.description.fil
Fil: Roldan, Juan Bautista. Universidad de Granada; España
dc.description.fil
Fil: Puglisi, Francesco Maria. Università di Modena e Reggio Emilia; Italia
dc.description.fil
Fil: Larcher, Luca. Applied Materials Incorporated; Italia
dc.description.fil
Fil: Hou, Tuo-Hung. National Chiao Tung University; China
dc.description.fil
Fil: Prodromakis, Themis. University of Southampton; Reino Unido
dc.description.fil
Fil: Yang, Yuchao. Peking University; China
dc.description.fil
Fil: Huang, Peng. Peking University; China
dc.description.fil
Fil: Wan, Tianqing. Hong Kong Polytechnic University; Hong Kong
dc.description.fil
Fil: Chai, Yang. Hong Kong Polytechnic University; Hong Kong
dc.journal.title
ACS Nano
dc.relation.alternativeid
info:eu-repo/semantics/altIdentifier/url/https://pubs.acs.org/doi/10.1021/acsnano.1c06980
dc.relation.alternativeid
info:eu-repo/semantics/altIdentifier/doi/http://dx.doi.org/10.1021/acsnano.1c06980
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