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dc.contributor.author
Lanza, Rodolfo Mario  
dc.contributor.author
Waser, Rainer  
dc.contributor.author
Ielmini, Daniele  
dc.contributor.author
Yang, J. Joshua  
dc.contributor.author
Goux, Ludovic  
dc.contributor.author
Suñe, Jordi  
dc.contributor.author
Kenyon, Anthony Joseph  
dc.contributor.author
Mehonic, Adnan  
dc.contributor.author
Spiga, Sabina  
dc.contributor.author
Rana, Vikas  
dc.contributor.author
Wiefels, Stefan  
dc.contributor.author
Menzel, Stephan  
dc.contributor.author
Valov, Ilia  
dc.contributor.author
Villena, Marco A.  
dc.contributor.author
Miranda, Enrique  
dc.contributor.author
Jing, Xu  
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Campabadal, Francesca  
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Gonzalez, Mireia B.  
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Aguirre, Fernando Leonel  
dc.contributor.author
Palumbo, Felix Roberto Mario  
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Zhu, Kaichen  
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Roldan, Juan Bautista  
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Puglisi, Francesco Maria  
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Larcher, Luca  
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Hou, Tuo-Hung  
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Prodromakis, Themis  
dc.contributor.author
Yang, Yuchao  
dc.contributor.author
Huang, Peng  
dc.contributor.author
Wan, Tianqing  
dc.contributor.author
Chai, Yang  
dc.date.available
2022-08-25T12:41:47Z  
dc.date.issued
2021-11  
dc.identifier.citation
Lanza, Rodolfo Mario; Waser, Rainer; Ielmini, Daniele; Yang, J. Joshua; Goux, Ludovic; et al.; Standards for the Characterization of Endurance in Resistive Switching Devices; American Chemical Society; ACS Nano; 15; 11; 11-2021; 17214–17231  
dc.identifier.issn
1936-0851  
dc.identifier.uri
http://hdl.handle.net/11336/166558  
dc.description.abstract
Resistive switching (RS) devices are emerging electronic components that could have applications in multiple types of integrated circuits, including electronic memories, true random number generators, radiofrequency switches, neuromorphic vision sensors, and artificial neural networks. The main factor hindering the massive employment of RS devices in commercial circuits is related to variability and reliability issues, which are usually evaluated through switching endurance tests. However, we note that most studies that claimed high endurances >106 cycles were based on resistance versus cycle plots that contain very few data points (in many cases even <20), and which are collected in only one device. We recommend not to use such a characterization method because it is highly inaccurate and unreliable (i.e., it cannot reliably demonstrate that the device effectively switches in every cycle and it ignores cycle-to-cycle and device-to-device variability). This has created a blurry vision of the real performance of RS devices and in many cases has exaggerated their potential. This article proposes and describes a method for the correct characterization of switching endurance in RS devices; this method aims to construct endurance plots showing one data point per cycle and resistive state and combine data from multiple devices. Adopting this recommended method should result in more reliable literature in the field of RS technologies, which should accelerate their integration in commercial products.  
dc.format
application/pdf  
dc.language.iso
eng  
dc.publisher
American Chemical Society  
dc.rights
info:eu-repo/semantics/openAccess  
dc.rights.uri
https://creativecommons.org/licenses/by-nc-nd/2.5/ar/  
dc.subject
CHARACTERIZATION  
dc.subject
ENDURANCE  
dc.subject
MEMORY  
dc.subject
MEMRISTOR  
dc.subject
METAL-OXIDE  
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RELIABILITY  
dc.subject
RESISTIVE SWITCHING  
dc.subject
VARIABILITY  
dc.subject.classification
Nano-materiales  
dc.subject.classification
Nanotecnología  
dc.subject.classification
INGENIERÍAS Y TECNOLOGÍAS  
dc.title
Standards for the Characterization of Endurance in Resistive Switching Devices  
dc.type
info:eu-repo/semantics/article  
dc.type
info:ar-repo/semantics/artículo  
dc.type
info:eu-repo/semantics/publishedVersion  
dc.date.updated
2022-08-23T11:17:17Z  
dc.journal.volume
15  
dc.journal.number
11  
dc.journal.pagination
17214–17231  
dc.journal.pais
Estados Unidos  
dc.journal.ciudad
Washington  
dc.description.fil
Fil: Lanza, Rodolfo Mario. King Abdullah University of Science and Technology; Arabia Saudita  
dc.description.fil
Fil: Waser, Rainer. Helmholtz Gemeinschaft. Forschungszentrum Jülich; Alemania. Rwth Aachen University; Alemania  
dc.description.fil
Fil: Ielmini, Daniele. Politecnico di Milano; Italia  
dc.description.fil
Fil: Yang, J. Joshua. University of Southern California; Estados Unidos  
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Fil: Goux, Ludovic. Interuniversity Microelectronics Centre; Bélgica  
dc.description.fil
Fil: Suñe, Jordi. Universitat Autònoma de Barcelona; España  
dc.description.fil
Fil: Kenyon, Anthony Joseph. Colegio Universitario de Londres; Reino Unido  
dc.description.fil
Fil: Mehonic, Adnan. Colegio Universitario de Londres; Reino Unido  
dc.description.fil
Fil: Spiga, Sabina. Consiglio Nazionale delle Ricerche; Italia. Istituto per la Microelettronica e Microsistemi; Italia  
dc.description.fil
Fil: Rana, Vikas. Helmholtz Gemeinschaft. Forschungszentrum Jülich; Alemania  
dc.description.fil
Fil: Wiefels, Stefan. Helmholtz Gemeinschaft. Forschungszentrum Jülich; Alemania  
dc.description.fil
Fil: Menzel, Stephan. Helmholtz Gemeinschaft. Forschungszentrum Jülich; Alemania  
dc.description.fil
Fil: Valov, Ilia. Helmholtz Gemeinschaft. Forschungszentrum Jülich; Alemania  
dc.description.fil
Fil: Villena, Marco A.. Applied Materials Incorporated; Italia  
dc.description.fil
Fil: Miranda, Enrique. Universitat Autònoma de Barcelona; España  
dc.description.fil
Fil: Jing, Xu. Southeast University; China  
dc.description.fil
Fil: Campabadal, Francesca. Consejo Superior de Investigaciones Científicas; España  
dc.description.fil
Fil: Gonzalez, Mireia B.. Consejo Superior de Investigaciones Científicas; España  
dc.description.fil
Fil: Aguirre, Fernando Leonel. Consejo Nacional de Investigaciones Científicas y Técnicas; Argentina. Universidad Tecnológica Nacional. Facultad Regional Buenos Aires. Unidad de Investigación y Desarrollo de las Ingenierías; Argentina  
dc.description.fil
Fil: Palumbo, Felix Roberto Mario. Consejo Nacional de Investigaciones Científicas y Técnicas; Argentina. Universidad Tecnológica Nacional. Facultad Regional Buenos Aires. Unidad de Investigación y Desarrollo de las Ingenierías; Argentina  
dc.description.fil
Fil: Zhu, Kaichen. King Abdullah University of Science and Technology; Arabia Saudita  
dc.description.fil
Fil: Roldan, Juan Bautista. Universidad de Granada; España  
dc.description.fil
Fil: Puglisi, Francesco Maria. Università di Modena e Reggio Emilia; Italia  
dc.description.fil
Fil: Larcher, Luca. Applied Materials Incorporated; Italia  
dc.description.fil
Fil: Hou, Tuo-Hung. National Chiao Tung University; China  
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Fil: Prodromakis, Themis. University of Southampton; Reino Unido  
dc.description.fil
Fil: Yang, Yuchao. Peking University; China  
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Fil: Huang, Peng. Peking University; China  
dc.description.fil
Fil: Wan, Tianqing. Hong Kong Polytechnic University; Hong Kong  
dc.description.fil
Fil: Chai, Yang. Hong Kong Polytechnic University; Hong Kong  
dc.journal.title
ACS Nano  
dc.relation.alternativeid
info:eu-repo/semantics/altIdentifier/url/https://pubs.acs.org/doi/10.1021/acsnano.1c06980  
dc.relation.alternativeid
info:eu-repo/semantics/altIdentifier/doi/http://dx.doi.org/10.1021/acsnano.1c06980