A Novel Approach for Simple, Fast and Cheap Packaging of MEMS and MMIC

Abstract

The packaging of MEMS and MMIC devices has become a trending topic in the last years. This paperpresents a novel approach for MEMS and MMIC packaging. The proposed packaging procedure combines simplesingle layer printed circuit board (PCB) techniques, Wire-Bonding and 3D printing, resulting in a simple, fast andcheap alternative. Since there is no need for Via Holes the package performance is privileged while the fabricationprocess is simplified. The novel approach was used in the design and fabrication of a package for a RF MEMSdigital phase shifter. The simulation and measurements data are presented alongside with the related conclusions.