Artículo

Citotoxicidad de Hidroxiapatita y su morfología en composites con Ti

Comin, RominaIcon ; Reyna Musso, Laura A.; Cid, Mariana PaulaIcon ; Oldani, Carlos Rodolfo; Salvatierra, Nancy AliciaIcon
Fecha de publicación: 01/2013
Editorial: Institute of Electrical and Electronics Engineers
Revista: IEEE Latin America Transactions
ISSN: 1548-0992
Idioma: Español
Tipo de recurso: Artículo publicado
Clasificación temática:

Resumen

Hydroxyapatite (Ca10(PO4)6(OH)2 is the material used to improve osseointegration of implants in humans. Traditionally Ti-based implant is coated with hydroxyapatite, but this presents several problems such as, low fracture toughness of hydroxyapatite, generation of interfacial cracks during the deposition step and low adhesion ceramic /metal. Furthermore some studies reported that some excellent Ti-HA bio-composites could be fabricated by the powder metallurgy (PM) technology. In present study it was investigate the cytotoxicity of coralline and bovine hydroxyapatite. Topography of Ti-HA composites obtained by powder metallurgy was evaluated by scanning electron microscopy. The results showed that HA samples analyzed did not affect cell viability. Furthermore, a good integration of HA to the matrix of Ti was observed by microscopy studies
Palabras clave: Composite , Pulvimetalurgia , Hidroxiapatita , Biocompatibilidad
 
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info:eu-repo/semantics/openAccess Excepto donde se diga explícitamente, este item se publica bajo la siguiente descripción: Creative Commons Attribution-NonCommercial-ShareAlike 2.5 Unported (CC BY-NC-SA 2.5)
Identificadores
URI: http://hdl.handle.net/11336/76806
DOI: http://dx.doi.org/10.1109/TLA.2013.6502785
URL: https://ieeexplore.ieee.org/document/6502785
Colecciones
Articulos(IIBYT)
Articulos de INSTITUTO DE INVESTIGACIONES BIOLOGICAS Y TECNOLOGICAS
Citación
Comin, Romina; Reyna Musso, Laura A.; Cid, Mariana Paula; Oldani, Carlos Rodolfo; Salvatierra, Nancy Alicia; Citotoxicidad de Hidroxiapatita y su morfología en composites con Ti; Institute of Electrical and Electronics Engineers; IEEE Latin America Transactions; 11; 1; 1-2013; 97-100
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