Artículo

Morphology of copper deposits obtained by metallic electrodeposition

González Mercado, Griselda VerónicaIcon ; Gonzalez, Carlos JacintoIcon ; Oliva, Marcos IvánIcon ; Brunetti, VeronicaIcon ; Eimer, Griselda AlejandraIcon
Fecha de publicación: 07/2015
Editorial: ELSEVIER Ltd.
Revista: PROCEDIA MATERIALS SCIENCE
ISSN: 2211-8128
Idioma: Inglés
Tipo de recurso: Artículo publicado
Clasificación temática:

Resumen

Electrochemical deposition of copper from copper nitrate aqueous electrolyte on graphite substrate was investigated at current densities between 0.03 mA/cm2 - 1.36 mA/cm2 and in the voltage range of 3 V to 15 V. The surface morphology and elemental composition of the resultant deposit were characterized by electron microprobe analysis (EMPA). These images illustrate the influence of current density on the shape of copper electrodeposited on the electrode surface. Rods, polyhedral bodies, pentagonal pyramids, dendritics, spiked spheres or cauliflower-like shapes are observed depending on the electrodeposition conditions.
Palabras clave: Electrodeposition , Empa , Superficial Morphology , Copper
 
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info:eu-repo/semantics/openAccess Excepto donde se diga explícitamente, este item se publica bajo la siguiente descripción: Creative Commons Attribution-NonCommercial-ShareAlike 2.5 Unported (CC BY-NC-SA 2.5)
Identificadores
URI: http://hdl.handle.net/11336/43790
URL: https://www.sciencedirect.com/science/article/pii/S2211812815001200
DOI: http://dx.doi.org/10.1016/j.mspro.2015.04.119
Colecciones
Articulos(INFIQC)
Articulos de INST.DE INVESTIGACIONES EN FISICO- QUIMICA DE CORDOBA
Citación
González Mercado, Griselda Verónica; Gonzalez, Carlos Jacinto; Oliva, Marcos Iván; Brunetti, Veronica; Eimer, Griselda Alejandra; Morphology of copper deposits obtained by metallic electrodeposition; ELSEVIER Ltd.; PROCEDIA MATERIALS SCIENCE; 8; 7-2015; 635-640
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