Artículo
Formation of Cu and Ni Nanowires by Electrodeposition
Fecha de publicación:
01/2015
Editorial:
ELSEVIER SCIENCE INC
Revista:
Procedia Materials Science
ISSN:
2211-8128
Idioma:
Inglés
Tipo de recurso:
Artículo publicado
Clasificación temática:
Resumen
In this work, the formation of Cu and Ni nanowires by electrodeposition inside alumina templates was analyzed. The depositswere performed from CuSO4 + H2SO4 and NiSO4 + NiCl2 + H3BO3 + H2SO4 solutions for the electrodeposition of Cu and Ni,respectively. To allow the cations deposition, sufficiently negative potentials were used. The experience time was rangedbetween 500s and 1h. After the metal electrodeposition, the sample was immersed in NaOH to dissolve the alumina membraneand to expose the generated deposit. The obtained nanostructures were characterized by SEM (scanning electron microscopy).Deposits were corresponded with nanowires having an average diameter of 300 nm. The length of the nanostructures was about10 microns.
Palabras clave:
Nanowires
,
Electrodeposition
,
Aluminium Oxide Template
,
Copper
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Identificadores
Colecciones
Articulos(CCT - BAHIA BLANCA)
Articulos de CTRO.CIENTIFICO TECNOL.CONICET - BAHIA BLANCA
Articulos de CTRO.CIENTIFICO TECNOL.CONICET - BAHIA BLANCA
Citación
Meier, Lorena Alejandra; Alvarez, Andrea Elizabeth; Garcia, S.G.; del Barrio, Maria Cecilia; Formation of Cu and Ni Nanowires by Electrodeposition; ELSEVIER SCIENCE INC; Procedia Materials Science; 8; 1-2015; 617-622
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