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Artículo

Connection between safe refactorings and acceptance test driven development

Fontela, Carlos; Garrido, AlejandraIcon
Fecha de publicación: 09/2013
Editorial: Institute of Electrical and Electronics Engineers
Revista: IEEE Latin America Transactions
ISSN: 1548-0992
Idioma: Español
Tipo de recurso: Artículo publicado
Clasificación temática:
Otras Ciencias de la Computación e Información

Resumen

With the advent of improved strategies over Test Driven Development (TDD), like Acceptance TDD (ATDD), several benefits were recognized over the simple use of TDD with unit testing. In this article we propose an additional benefit of ATDD: the use of acceptance tests as ultimate invariants of the behavior that refactorings must preserve. Even when previous works have referred to this advantage of ATDD, the problem that remained unsolved was the lack of a complete and practical method that includes the different layers created by different types of tests. In this article we describe such a method, which uses multiple layers of tests and connects the layers through coverage analysis, in order to allow safe refactoring even when the refactorings break some tests. We also present Multilayer Coverage, an automatic tool for coverage analysis at different layers of tests and its intersection, to assist with the proposed method.
Palabras clave: Test Driven Development , Acceptance Test Driven Development , Refactoring , Behavior Preservation , Coverage , Agile Methods
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info:eu-repo/semantics/openAccess Excepto donde se diga explícitamente, este item se publica bajo la siguiente descripción: Creative Commons Attribution-NonCommercial-ShareAlike 2.5 Unported (CC BY-NC-SA 2.5)
Identificadores
URI: http://hdl.handle.net/11336/23196
URL: http://ieeexplore.ieee.org/document/6684399/
DOI: http://dx.doi.org/10.1109/TLA.2013.6684399
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Articulos(CCT - LA PLATA)
Articulos de CTRO.CIENTIFICO TECNOL.CONICET - LA PLATA
Citación
Fontela, Carlos; Garrido, Alejandra; Connection between safe refactorings and acceptance test driven development; Institute of Electrical and Electronics Engineers; IEEE Latin America Transactions; 11; 5; 9-2013; 1238-1244
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