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dc.contributor.author
Armanasco, Franco  
dc.contributor.author
Dhers, Sebastián  
dc.contributor.author
Chiacchiarelli, Leonel Matias  
dc.date.available
2024-02-22T11:43:26Z  
dc.date.issued
2023-05  
dc.identifier.citation
Armanasco, Franco; Dhers, Sebastián; Chiacchiarelli, Leonel Matias; The role of post‐cure cycle on the thermomechanical properties of soy‐based polyurethane thermosets; John Wiley & Sons; Journal of Applied Polymer Science; 140; 31; 5-2023; 1-15  
dc.identifier.issn
0021-8995  
dc.identifier.uri
http://hdl.handle.net/11336/227984  
dc.description.abstract
A systematic study of the post-cure cycle of soy-based polyurethane thermosets was conducted as a function of crosslinker content, post-cure temperature and time. An improvement of 207% of the flexural strength, up to 175 MPa, was measured by increasing the crosslinking content to 60 wt% and by using a post-cure cycle temperature of 110°C. Similarly, the flexural modulus also increased by 199%, up to 3.2 GPa, while maintaining a flexural strain to failure of 6.60%. In situ studies of the post-cure cycle using dynamical mechanical analysis revealed the interplay between the two interpenetrating polymer networks as a function of crosslinker content. At a crosslinker content below 40 wt%, two rubbery to glass transition temperatures (Tg) were found at 60 and 200°C, respectively. At 60 wt%, only one Tg at temperatures close to the degradation temperature was identified (250°C). Scanning electron microscope micrographs of the fracture surface revealed the formation of stress induced cracks which were mitigated through the use of a temperature stepped post-cure cycle. The formation of soft segments with high degradation temperatures (485°C) were revealed by thermogravimetric analysis, which can be attributed to the presence of additional covalent bonds such as allophanate and carbodiimide that were also identified through Fourier transform infrared analysis. The results revealed in this work are key for the development of biobased polyurethanes applied for the polymer composite industry. In this regard, this study represented the first analysis of the post-cure cycle of a soy-based polyurethane thermoset.  
dc.format
application/pdf  
dc.language.iso
eng  
dc.publisher
John Wiley & Sons  
dc.rights
info:eu-repo/semantics/restrictedAccess  
dc.rights.uri
https://creativecommons.org/licenses/by-nc-sa/2.5/ar/  
dc.subject
POST-CURE ANALYSIS  
dc.subject
SOY-BASED POLYURETHANE  
dc.subject
THERMOMECHANICAL PROPERTIES  
dc.subject
THERMOSET  
dc.subject.classification
Ingeniería de los Materiales  
dc.subject.classification
Ingeniería de los Materiales  
dc.subject.classification
INGENIERÍAS Y TECNOLOGÍAS  
dc.title
The role of post‐cure cycle on the thermomechanical properties of soy‐based polyurethane thermosets  
dc.type
info:eu-repo/semantics/article  
dc.type
info:ar-repo/semantics/artículo  
dc.type
info:eu-repo/semantics/publishedVersion  
dc.date.updated
2024-02-20T12:53:12Z  
dc.journal.volume
140  
dc.journal.number
31  
dc.journal.pagination
1-15  
dc.journal.pais
Estados Unidos  
dc.description.fil
Fil: Armanasco, Franco. Consejo Nacional de Investigaciones Científicas y Técnicas. Oficina de Coordinación Administrativa Houssay. Instituto de Tecnología en Polímeros y Nanotecnología. Universidad de Buenos Aires. Facultad de Ingeniería. Instituto de Tecnología en Polímeros y Nanotecnología; Argentina  
dc.description.fil
Fil: Dhers, Sebastián. Instituto Tecnológico de Buenos Aires; Argentina  
dc.description.fil
Fil: Chiacchiarelli, Leonel Matias. Consejo Nacional de Investigaciones Científicas y Técnicas. Oficina de Coordinación Administrativa Houssay. Instituto de Tecnología en Polímeros y Nanotecnología. Universidad de Buenos Aires. Facultad de Ingeniería. Instituto de Tecnología en Polímeros y Nanotecnología; Argentina  
dc.journal.title
Journal of Applied Polymer Science  
dc.relation.alternativeid
info:eu-repo/semantics/altIdentifier/url/https://onlinelibrary.wiley.com/doi/10.1002/app.54223  
dc.relation.alternativeid
info:eu-repo/semantics/altIdentifier/doi/http://dx.doi.org/10.1002/app.54223