Artículo
Crystal structure of Cu-Sn-in alloys around the η-phase field studied by neutron diffraction
Fecha de publicación:
06/2012
Editorial:
Springer
Revista:
Journal Of Electronic Materials
ISSN:
0361-5235
Idioma:
Inglés
Tipo de recurso:
Artículo publicado
Clasificación temática:
Resumen
The study of the Cu-Sn-In ternary system has become of great importance in recent years, due to new environmental regulations forcing to Eliminate the use of Pb from bonding technologies for electronic devices. A key relevant issue concerns the intermetallic phases which grow in the bonding zone and are determining in their quality and performance. In this work, we focus in the η-phase (Cu2In or Cu6Sn5) that exists in both end binaries and as a ternary phase. We present a neutron diffraction study of the constitution and crystallography of a series of alloys around the 60 at.% Cu composition, and with In contents ranging from 0 to 25 at.%, quenched from 300oC. The alloys were characterized by scanning electron microscopy (SEM), probe microanalysis (EPMA) and high-resolution neutron diffraction (ND). The Rietveld refinement of neutron diffraction data allowed to improve the currently available model for site ccupancies in the hexagonal η-phase in the binary Cu-Sn as well as in ternary alloys. For the first time, structural data is reported in the ternary Cu-Sn-In η-phase as a function of composition, information that is of fundamental technological importance as well as valuable input data for the ongoing modelling of the ternary phase diagram.
Palabras clave:
CU-SN ALLOYS
,
NEUTRON DIFFRACTION
,
PB-FREE SOLDERS
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Articulos(CCT - PATAGONIA NORTE)
Articulos de CTRO.CIENTIFICO TECNOL.CONICET - PATAGONIA NORTE
Articulos de CTRO.CIENTIFICO TECNOL.CONICET - PATAGONIA NORTE
Citación
Aurelio, Gabriela; Sommadossi, Silvana Andrea; Cuello, G. J.; Crystal structure of Cu-Sn-in alloys around the η-phase field studied by neutron diffraction; Springer; Journal Of Electronic Materials; 41; 11; 6-2012; 3223-3231
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