Mostrar el registro sencillo del ítem
dc.contributor.author
Lanza, Mario
dc.contributor.author
Palumbo, Felix Roberto Mario
dc.contributor.author
Shi, Yuanyuan
dc.contributor.author
Aguirre, Fernando Leonel
dc.contributor.author
Boyeras Baldomá, Santiago
dc.contributor.author
Yuan, Bin
dc.contributor.author
Yalon, Eilam
dc.contributor.author
Moreno, Enrique
dc.contributor.author
Wu, Tianru
dc.contributor.author
Roldan, Juan B.
dc.date.available
2022-08-18T18:15:03Z
dc.date.issued
2021-08-12
dc.identifier.citation
Lanza, Mario; Palumbo, Felix Roberto Mario; Shi, Yuanyuan; Aguirre, Fernando Leonel; Boyeras Baldomá, Santiago; et al.; Temperature of Conductive Nanofilaments in Hexagonal Boron Nitride Based Memristors Showing Threshold Resistive Switching; John Wiley and Sons Inc; Advanced Electronic Materials; 2021; 12-8-2021; 1-7
dc.identifier.issn
2199-160X
dc.identifier.uri
http://hdl.handle.net/11336/166055
dc.description.abstract
Two-terminal metal/insulator/metal (MIM) memristors exhibiting threshold resistive switching (RS) can develop advanced key tasks in solid-state nano/ micro-electronic circuits, such as selectors and integrate-and-fire electronic neurons. MIM-like memristors using multilayer hexagonal boron nitride (h-BN) as dielectric are especially interesting because they have shown threshold RS with ultra-low energy consumption per state transition down to the zeptojoule regime. However, the factors enabling stable threshold RS at such low operation energies are still not fully understood. Here it is shown that the threshold RS in 150 nm × 150 nm Au/Ag/h-BN/Au memristors is especially stable because the temperature in the h-BN stack during operation (i.e., at low currents ≈1 μA) is very low (i.e., ≈310 K), due to the high in-plane thermal conductivity of h-BN and its low thickness. Only when the device is operated at higher currents (i.e., ≈200 μA) the temperatures at the h-BN increase remarkably (i.e., >500 K), which produce a stable non-volatile conductive nanofilament (CNF). This work can bring new insights to understand the performance of 2D materials based RS devices, and help to develop the integration of 2D materials in high-density nanoelectronics.
dc.format
application/pdf
dc.language.iso
eng
dc.publisher
John Wiley and Sons Inc
dc.rights
info:eu-repo/semantics/restrictedAccess
dc.rights.uri
https://creativecommons.org/licenses/by-nc-sa/2.5/ar/
dc.subject
CONDUCTIVE NANO-FILAMENTS
dc.subject
HEXAGONAL BORON NITRIDE
dc.subject
MEMRISTOR
dc.subject
TEMPERATURE CALCULATION
dc.subject
THRESHOLD RESISTIVE SWITCHING
dc.subject.classification
Nano-materiales
dc.subject.classification
Nanotecnología
dc.subject.classification
INGENIERÍAS Y TECNOLOGÍAS
dc.subject.classification
Nano-procesamiento
dc.subject.classification
Nanotecnología
dc.subject.classification
INGENIERÍAS Y TECNOLOGÍAS
dc.title
Temperature of Conductive Nanofilaments in Hexagonal Boron Nitride Based Memristors Showing Threshold Resistive Switching
dc.type
info:eu-repo/semantics/article
dc.type
info:ar-repo/semantics/artículo
dc.type
info:eu-repo/semantics/publishedVersion
dc.date.updated
2022-08-16T18:05:54Z
dc.identifier.eissn
2199-160X
dc.journal.volume
2021
dc.journal.pagination
1-7
dc.journal.pais
Alemania
dc.description.fil
Fil: Lanza, Mario. King Abdullah University of Science and Technology; Arabia Saudita
dc.description.fil
Fil: Palumbo, Felix Roberto Mario. Universidad Tecnológica Nacional. Facultad Regional Buenos Aires. Unidad de Investigación y Desarrollo de las Ingenierías; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas; Argentina
dc.description.fil
Fil: Shi, Yuanyuan. Interuniversity Microelectronics Centre; Bélgica
dc.description.fil
Fil: Aguirre, Fernando Leonel. Universidad Tecnológica Nacional. Facultad Regional Buenos Aires. Unidad de Investigación y Desarrollo de las Ingenierías; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas; Argentina
dc.description.fil
Fil: Boyeras Baldomá, Santiago. Universidad Tecnológica Nacional. Facultad Regional Buenos Aires. Unidad de Investigación y Desarrollo de las Ingenierías; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas; Argentina
dc.description.fil
Fil: Yuan, Bin. Universidad de Barcelona; España. Guangdong Technion – Israel Institute of Technology; China
dc.description.fil
Fil: Yalon, Eilam. Technion–Israel Institute of Technology; Israel
dc.description.fil
Fil: Moreno, Enrique. University of Lyon; Francia. Centre National de la Recherche Scientifique; Francia
dc.description.fil
Fil: Wu, Tianru. Shanghai Tech University; China
dc.description.fil
Fil: Roldan, Juan B.. Universidad de Granada; España
dc.journal.title
Advanced Electronic Materials
dc.relation.alternativeid
info:eu-repo/semantics/altIdentifier/url/https://onlinelibrary.wiley.com/doi/10.1002/aelm.202100580
dc.relation.alternativeid
info:eu-repo/semantics/altIdentifier/doi/http://dx.doi.org/10.1002/aelm.202100580
Archivos asociados