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dc.contributor.author
Lanza, Mario  
dc.contributor.author
Palumbo, Felix Roberto Mario  
dc.contributor.author
Shi, Yuanyuan  
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Aguirre, Fernando Leonel  
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Boyeras Baldomá, Santiago  
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Yuan, Bin  
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Yalon, Eilam  
dc.contributor.author
Moreno, Enrique  
dc.contributor.author
Wu, Tianru  
dc.contributor.author
Roldan, Juan B.  
dc.date.available
2022-08-18T18:15:03Z  
dc.date.issued
2021-08-12  
dc.identifier.citation
Lanza, Mario; Palumbo, Felix Roberto Mario; Shi, Yuanyuan; Aguirre, Fernando Leonel; Boyeras Baldomá, Santiago; et al.; Temperature of Conductive Nanofilaments in Hexagonal Boron Nitride Based Memristors Showing Threshold Resistive Switching; John Wiley and Sons Inc; Advanced Electronic Materials; 2021; 12-8-2021; 1-7  
dc.identifier.issn
2199-160X  
dc.identifier.uri
http://hdl.handle.net/11336/166055  
dc.description.abstract
Two-terminal metal/insulator/metal (MIM) memristors exhibiting threshold resistive switching (RS) can develop advanced key tasks in solid-state nano/ micro-electronic circuits, such as selectors and integrate-and-fire electronic neurons. MIM-like memristors using multilayer hexagonal boron nitride (h-BN) as dielectric are especially interesting because they have shown threshold RS with ultra-low energy consumption per state transition down to the zeptojoule regime. However, the factors enabling stable threshold RS at such low operation energies are still not fully understood. Here it is shown that the threshold RS in 150 nm × 150 nm Au/Ag/h-BN/Au memristors is especially stable because the temperature in the h-BN stack during operation (i.e., at low currents ≈1 μA) is very low (i.e., ≈310 K), due to the high in-plane thermal conductivity of h-BN and its low thickness. Only when the device is operated at higher currents (i.e., ≈200 μA) the temperatures at the h-BN increase remarkably (i.e., >500 K), which produce a stable non-volatile conductive nanofilament (CNF). This work can bring new insights to understand the performance of 2D materials based RS devices, and help to develop the integration of 2D materials in high-density nanoelectronics.  
dc.format
application/pdf  
dc.language.iso
eng  
dc.publisher
John Wiley and Sons Inc  
dc.rights
info:eu-repo/semantics/restrictedAccess  
dc.rights.uri
https://creativecommons.org/licenses/by-nc-sa/2.5/ar/  
dc.subject
CONDUCTIVE NANO-FILAMENTS  
dc.subject
HEXAGONAL BORON NITRIDE  
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MEMRISTOR  
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TEMPERATURE CALCULATION  
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THRESHOLD RESISTIVE SWITCHING  
dc.subject.classification
Nano-materiales  
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Nanotecnología  
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INGENIERÍAS Y TECNOLOGÍAS  
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Nano-procesamiento  
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Nanotecnología  
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INGENIERÍAS Y TECNOLOGÍAS  
dc.title
Temperature of Conductive Nanofilaments in Hexagonal Boron Nitride Based Memristors Showing Threshold Resistive Switching  
dc.type
info:eu-repo/semantics/article  
dc.type
info:ar-repo/semantics/artículo  
dc.type
info:eu-repo/semantics/publishedVersion  
dc.date.updated
2022-08-16T18:05:54Z  
dc.identifier.eissn
2199-160X  
dc.journal.volume
2021  
dc.journal.pagination
1-7  
dc.journal.pais
Alemania  
dc.description.fil
Fil: Lanza, Mario. King Abdullah University of Science and Technology; Arabia Saudita  
dc.description.fil
Fil: Palumbo, Felix Roberto Mario. Universidad Tecnológica Nacional. Facultad Regional Buenos Aires. Unidad de Investigación y Desarrollo de las Ingenierías; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas; Argentina  
dc.description.fil
Fil: Shi, Yuanyuan. Interuniversity Microelectronics Centre; Bélgica  
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Fil: Aguirre, Fernando Leonel. Universidad Tecnológica Nacional. Facultad Regional Buenos Aires. Unidad de Investigación y Desarrollo de las Ingenierías; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas; Argentina  
dc.description.fil
Fil: Boyeras Baldomá, Santiago. Universidad Tecnológica Nacional. Facultad Regional Buenos Aires. Unidad de Investigación y Desarrollo de las Ingenierías; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas; Argentina  
dc.description.fil
Fil: Yuan, Bin. Universidad de Barcelona; España. Guangdong Technion – Israel Institute of Technology; China  
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Fil: Yalon, Eilam. Technion–Israel Institute of Technology; Israel  
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Fil: Moreno, Enrique. University of Lyon; Francia. Centre National de la Recherche Scientifique; Francia  
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Fil: Wu, Tianru. Shanghai Tech University; China  
dc.description.fil
Fil: Roldan, Juan B.. Universidad de Granada; España  
dc.journal.title
Advanced Electronic Materials  
dc.relation.alternativeid
info:eu-repo/semantics/altIdentifier/url/https://onlinelibrary.wiley.com/doi/10.1002/aelm.202100580  
dc.relation.alternativeid
info:eu-repo/semantics/altIdentifier/doi/http://dx.doi.org/10.1002/aelm.202100580