Artículo
Atomic force microscopy nano-indentation for testing mechanical properties in thin films
Fecha de publicación:
07/2019
Editorial:
Elsevier
Revista:
Materials Today: Proceedings
ISSN:
2214-7853
Idioma:
Inglés
Tipo de recurso:
Artículo publicado
Clasificación temática:
Resumen
We study the mechanical properties of Cu thin films on Si (100) by performing nano-indentation using an atomic force microscopy. Cu films with thickness of 0.3 μm, 1 μm and 2 μm were analyzed. Area profile studies let us understand the critical influence of the indenter geometry uncertainty on the estimation of the mechanical properties. This seems to be very important when studying thin films because penetrations depths are very small and close to the indenter apex which could have geometrical discontinuities. We found that the hardness of the samples and Young modulus decreases as the film thickness increases. The origin of this behavior could be ascribed to a substrate-film mechanical coupling or a microstructural effect.
Palabras clave:
ATOMIC FORCE MICROSCOPY
,
CONTACT MECHANICS
,
DEPTH SENSING INDENTATION
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Licencia
Identificadores
Colecciones
Articulos (UE-INN - NODO BARILOCHE)
Articulos de UNIDAD EJECUTORA INSTITUTO DE NANOCIENCIA Y NANOTECNOLOGIA - NODO BARILOCHE
Articulos de UNIDAD EJECUTORA INSTITUTO DE NANOCIENCIA Y NANOTECNOLOGIA - NODO BARILOCHE
Citación
Roa Díaz, Simón Andre; Haberkorn, Nestor Fabian; Sirena, Martin; Atomic force microscopy nano-indentation for testing mechanical properties in thin films; Elsevier; Materials Today: Proceedings; 14; 7-2019; 113-116
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