Artículo
Development and Validation of a LiDAR Scanner for 3D Evaluation of Soil Vegetal Coverage
Micheletto, Matías Javier
; Zubiaga, Luciano
; Santos, Rodrigo Martin
; Galantini, Juan Alberto; Cantamutto, Miguel Ángel; Orozco, Javier Dario
Fecha de publicación:
07/01/2020
Editorial:
Multidisciplinary Digital Publishing Institute
Revista:
Electronics
e-ISSN:
2079-9292
Idioma:
Inglés
Tipo de recurso:
Artículo publicado
Clasificación temática:
Resumen
Water and wind erosion are serious problems due to the loss of soil productivity. The coverage of soil, by means of cover crops or crops residues, is an effective tool to prevent wind and water erosion. The soil coverage could curb wind on the surface, avoid water runoff and reduce direct soil evaporation. Residue spatial distribution is the main factor to successful soil protection. The current work presents details of a prototype, design and validation as a measuring instrument to sense the height of vegetal crop residues based on a short-ranged laser distance sensor (LiDAR) and a computer numerical control (CNC) mechanism. The results obtained in this work showed a high level of confidence to estimate the height and composition of soil vegetal coverage.
Palabras clave:
EMBEDDED SYSTEMS
,
CNC
,
SOIL VEGETAL COVER
,
SUSTAINABLE AGRICULTURE
Archivos asociados
Licencia
Identificadores
Colecciones
Articulos (ICIC)
Articulos de INSTITUTO DE CS. E INGENIERIA DE LA COMPUTACION
Articulos de INSTITUTO DE CS. E INGENIERIA DE LA COMPUTACION
Articulos(CERZOS)
Articulos de CENTRO REC.NAT.RENOVABLES DE ZONA SEMIARIDA(I)
Articulos de CENTRO REC.NAT.RENOVABLES DE ZONA SEMIARIDA(I)
Articulos(IIIE)
Articulos de INST.DE INVEST.EN ING.ELECTRICA "A.DESAGES"
Articulos de INST.DE INVEST.EN ING.ELECTRICA "A.DESAGES"
Citación
Micheletto, Matías Javier; Zubiaga, Luciano; Santos, Rodrigo Martin; Galantini, Juan Alberto; Cantamutto, Miguel Ángel; et al.; Development and Validation of a LiDAR Scanner for 3D Evaluation of Soil Vegetal Coverage; Multidisciplinary Digital Publishing Institute; Electronics; 9; 1; 7-1-2020; 1-19
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